The Selective Soldering Machine is an advanced and versatile solution designed to meet the high-precision soldering needs of modern electronics manufacturing. It is ideal for applications requiring selective soldering of through-hole components on printed circuit boards (PCBs) without compromising nearby components or assemblies.
Compact and Durable Design:
The machine is built with a robust frame and efficient layout, ensuring durability and ease of use while optimizing floor space.
Precision Solder Pot with Electromagnetic Pump:
Equipped with an advanced electromagnetic pump system, the solder pot delivers accurate and controlled solder flow for precise soldering, reducing defects and rework.
Adjustable Transport Width:
The transport system allows for width adjustments to accommodate various PCB sizes, offering flexibility for multiple production needs.
High Accuracy and Repeatability:
The machine delivers consistent solder joints with high positional accuracy, ensuring reliable performance across multiple soldering points.
Low Nitrogen Consumption:
The system is engineered to minimize nitrogen usage, resulting in cost-effective operation while maintaining a clean soldering environment.
Single Track and Dual Pot Options:
The soldering system provides flexibility with single track single pot or dual pot configurations to adapt to production scale and requirements.
Modular Design:
Supports one, two, or three module setups, enabling efficient scalability and the ability to handle varying production volumes.
Technical Specifications:
Dimensions: Varies by model (e.g., 4200×1915×1571 mm).
PCB Size: Supports PCBs up to 510×510 mm.
Conveyor Height: 900 ± 20 mm for smooth PCB handling.
Transport Width Adjustment: Up to 510 mm for flexible board configurations.
Solder Pot: Advanced solder pot system with precise electromagnetic pumping technology.
Tin Dross Control: Efficient operation ensures minimal tin waste, saving material costs.
Nitrogen Consumption: Optimized at 1.5-2 m³/h for reduced operational costs.
