Wave Soldering Machine GT-WS450

Wave Soldering Machine
buffer scheme
System of flux supply
LCD, Flux spray system, and exhaust fan
Prior heater
Lifting unit for solder pot
Solder pot with dual waves
cooling mechanism
Controller for adjusting angle
Finger washing apparatus
Conveyor system

Item	GT-WS450
Dimension: LWH(mm)	435015801750
Weight	Approx.1950kg
Power Supply	3PH 380V 50HZ
Start up Power	32KW
Normal Running Power	Approx.8.5KW
Control System	PC+PLC
Spraying movement	Step motor
Spraying Pressure	0.2Mpa~0.4Mpa
Flux Flow Control	Option
Auto Flux Filling	Standard
Exhausting	Top exhaust+Side exhaust
Exhausting Pipe Diameter(mm）	Φ250
Exhaust Capacity	30m³/min
Preheating Mode	(Hot air convection/IR)
Temperature Control Mode	PID
Preheating Zone Quantity	3
Preheating Zone Length(mm)	1800
Preheating Temperature Range	（Room temperature）~200℃
Warm-up Time(min)	Approx.12min(setting: 150℃)
Preheating Blower Motor	250W 3PH 220 VAC
Width(mm）	50~450
PCB Conveying Direction	L→R( Option:R→L)
Conveying Speed(mm/min)	500~1800
Conveying Height(mm)	750±20
Available Component Height(mm)	（Top）120（Option：250）(Bottom)15
Conveying Speed Control Mode	（Closed loop stepless speed regulation by inverter）
Finger	( Spring Pressing Finger)；(D-40 Type Finger)； (Double-hook Finger)；( Heavy type double hook ﬁnger)(Options)
Conveying Angle	4~7°
Solder Pot Type	(Mechanical)
Solder Pot Material	(Casting Iron)
Wave Height Adjustment	( Inverter):( Digital Control by PC)
Cooling type	( Air Cooling) Option:( Water cooling)
Solder Pot Heating Power	13.5KW
Max Solder Pot Temperature	300℃
Solder Pot Capacity	Approx.550kg
Wave Driving Power	180W*2 3PH 220 VAC
Solder Pot Warm-up Time	Approx.150min(setting: 250℃)
Temperature Control Mode	PID
Finger Cleaning System	(Brush)