Hybrid Placing Machine
This machine is based on the surface mount technology for placing SMD parts in high speed and incorporates semi-conductor technology for placing die parts with high accuracy. The NXT-H allows you to go form a batch process using dedicated machines to an innovative inline production process.
Supports panels up to 610 x 610 mm
For small power modules and sensor modules
Handles dies up to 24 x 24 mm
For complex modules such as communication and sensor modules
FUJI Pick and Place Machine
- Functions for high-mix production
- Wafer map display
- Inside machine is kept clean
- Maintenance guidance
1. Hybrid placement of wafers and SMDs
Wafer, tray part, and reel part placement in a single unit. Supports production mainly using feeder parts, or mainly using wafers and trays by exchanging units.
2. High accuracy placement
High rigidity construction with linear motor movement and high resolution cameras. Combines the optimum placing pressure, high accuracy and high quality using advanced control technology.
3. A HEPA filter provides a cleanroom class of 1000
With the assumption that this machine is going to be used in cleanrooms, the XY robot is cleanroom capable. By setting a HEPA filter, you can get an even better environment for semiconductors.
4. Easy Operation
Equipped with a large 15 inch touchscreen panel and graphical interface. United interface controls both machine and MWU12i operation. Covers both wafer map data management and format conversion. *Individual user formats can be supported separately.
