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Bga Rework Station 865
Bga Rework Station 865
The top and bottom heaters of 8650 can heat PCB from upper and bottom at the same time, and large preheating area can prevent the PCB board from deformation. The top and bottom heaters work independently, controlled by software, it makes the lead-free repair easily.The external sensors can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.
Description
BGA Rework Station 865
Automatic BGA Rework Station is an advanced SMT rework system designed for fully automated removal, reballing, and replacement of Ball Grid Array (BGA), CSP, QFN, and other complex package components. Featuring precision infrared heating, hot air circulation, and intelligent vision alignment, this station streamlines the rework process with minimal operator intervention.
Ideal for high-volume electronics manufacturing, this machine ensures consistent, high-quality solder joints while reducing downtime and labor costs. It supports lead-free soldering and is suitable for repairing multilayer PCBs in automotive, aerospace, telecom, and consumer electronics industries.
Precision Rework Solution for Ball Grid Array Components
|
1 |
Total Power |
22KW(Max) |
|
2 |
Top heater |
2000W(1st heater) |
|
3 |
Bottom heater |
2000W(2nd heater) |
|
4 |
3rd IR heater |
16000W(the left six IR heating plate can be controlled independently) |
|
5 |
power |
AC 380V±10%    50/60Hz |
|
6 |
Electrical materials |
Servo Drive (Panasonic)＋Industrial Host+ Heating plate(Germany) |
|
7 |
Optical system |
Servo Drive+ Automatic Vision Alignment System （Panasonic） |
|
8 |
Temperature control |
K-type thermocouple (Closed Loop), intelligent temperature compensation system, temperature precision within ±1 degree |
|
9 |
Positioning |
V-groove PCB support， and with external universal fixture |
|
10 |
PCB size |
660*600mm(Max);10*10mm(Min) |
|
11 |
BGA chip |
120*120mm(Max);1*1mm(Min) |
|
12 |
External temp sensor |
8 pcs |
|
13 |
Work Mode |
Computer intelligence operations |
|
14 |
Placement Accuracy |
X, Y axis and the R angle with micrometer adjust, servo drive, accuracy within ± 0.01MM |
|
15 |
Dimensions |
L1235*W1215*H1850mm (LCD stand not included) |
|
16 |
Net weight |
660kg |
Key Applications of BGA rework station
• Automated removal and placement of BGAs, CSPs, and QFNs
• High-precision rework for defective or misaligned SMT components
• Integration into SMT production lines for real-time repair
• Suitable for complex, high-value PCBs requiring reliable rework
Usage Benefits BGA rework station
• Reduces manual labor and operator errors with automated workflows
• Provides consistent thermal profiles for reliable solder joints
• Improves throughput and minimizes production downtime
• Advanced vision system ensures perfect component alignment every time
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