Solder Paste Printer P6

Advanced SMT Solder Paste Printer Series P6

Experience precision and reliability with our advanced line of solder paste printers, designed to meet the demanding requirements of modern SMT assembly processes.

PCB Size Compatibility

P6 Model: Accommodates PCB sizes up to 600 x 600 mm

Stencil Positioning System

Our innovative stencil positioning system ensures precise alignment for consistent solder paste deposition:

• High-precision servo motors with closed-loop control
• Advanced vision alignment system with dual cameras
• Automatic fiducial recognition and correction
• Real-time position feedback and compensation
• Programmable alignment points with automatic optimization

Printing Accuracy and Precision

Industry-leading printing capabilities deliver exceptional results:

• Printing accuracy: ±25 μm @ 6σ
• Print speed: Up to 150 mm/second
• Squeegee pressure control: 0-15kg, digitally controlled
• Programmable printing speed and pressure parameters
• Multi-zone vacuum support system for stable PCB fixturing

Automated Cleaning System

Integrated cleaning functionality maintains optimal stencil condition:

• Programmable wet/dry cleaning cycles
• Automatic paper advance system
• Vacuum-assisted cleaning process
• Solvent dispensing with controlled volume
• Paper roll monitoring with low-level warning

Platform Calibration of Solder paste printer

Sophisticated calibration features ensure consistent results:

• Automatic PCB thickness measurement and compensation
• Multi-point board surface mapping
• Dynamic Z-height adjustment
• Automatic squeegee height optimization
• Real-time warpage compensation

2D Solder Paste Inspection

Advanced inspection capabilities for quality assurance:

• High-resolution camera system for solder paste inspection
• Automatic volume and area measurement
• Real-time inspection results and analysis
• Configurable pass/fail criteria
• Statistical process control (SPC) data collection
• Defect classification and reporting

Conveyor System

• With programmable transportation speed, it can achieve a maximum transportation speed of 1500mm per second. The transportation direction can be left to right or right to left. Also, it supports left to left, or right to the right transmission direction

 PCB Paste Printing Quality Test and Analysis

Ensure the quality of product printing, this feature can quickly detect printing offset, insufficient paste, missing, bridge, and other defects.

Operating Interface

The easy operating interface of Windows XP, with convenient man-machine interacting function. Programming is designed with teaching and navigation functions, guidance is available at every step. English language operating interface is also available.

Optional Feature:

Stencil Inspection System

Through light source compensation at PCB stencil and CCD real-time inspection check on stencil holes which enable rapid detection, judging stencil after cleaning whether the stencil holes have been filled and auto cleaned by solder paste printer.

Automatic Add Solder Paste

Automatic add solder paste at periodic times to ensure the quality of the solder paste volume at stencil, thus guaranteeing printing quality and efficiency.

Automatic Dispensing System 

Given the different printing requirements, dispensing through glue, solder paste, dispense line, padding, etc, can be performed after the printing process. The dispensing head is adopted with a heating function to maintain glue viscosity with better fluidity

Industry 4.0

According to the solder paste machine status, its parameters can be automatically uploaded or output, which is supported for the customer industry 4.0 intelligent production. The connection will be seamless and realized with the customer MES system, product traceability, intelligent control machine maintenance

Support and Service

• Comprehensive warranty coverage
• Online technical support
• Regular maintenance programs available
• Operator training programs
• Worldwide service network for solder paste printer service