PCB Laser Depaneling Machine 340

A PCB laser depaneling machine is a high-precision, non-contact system used to separate individual printed circuit boards (PCBs) from a larger panel. Unlike traditional PCB cutting methods such as V-cut, routing, or punching, laser depaneling uses focused laser beams to achieve clean and accurate cuts without mechanical stress or physical contact. This makes it ideal for delicate, high-density, or irregularly shaped PCBs, especially in SMT (Surface Mount Technology) production lines.

Working of  PCB Laser Depaneling Machine

Laser depaneling machines utilize different types of lasers—commonly UV (ultraviolet), CO₂, or fiber lasers—depending on the PCB material and production requirements. UV lasers (355 nm wavelength) are most suitable for cutting FR4 PCBs, flex PCBs, and other fine structures because of their narrow beam and minimal heat-affected zone (HAZ). This ensures precision cutting without damaging adjacent SMT components.

Description of PCB Laser Depanling Machine:

Neat and smooth edge, no burr or overflow;

Wide application range, including FPC exterior cutting, profile cutting, drilling, opening windows for covering, etc.

Laser wavelength: 355nm

Rated power: 10W/12W/15W/18W@30KHz

Galvanometer working field Per One Process: 40 × 40mm

Power consumption for the whole machine: 2KW

Key Features of Laser Depaneling Machines

• Non-contact PCB separation: Reduces mechanical stress and component risk

• High precision and accuracy: Typical tolerance of ±10–20 µm

• CCD vision alignment: Ensures consistent cutting using fiducials or outlines

• Supports various PCB materials: FR4, flex, aluminum, ceramic, and composite boards

• Minimal dust and burrs: Clean cuts with no post-processing required

• No tooling required: Ideal for prototyping or frequent PCB design changes

• Fully automatable: Can be integrated with SMT lines, MES, or ERP systems

Advantages in SMT Production

In the SMT manufacturing industry, laser depaneling machines provide multiple advantages over conventional mechanical depaneling methods:

• Stress-Free PCB Cutting: No bending, warping, or cracking of boards

• Perfect for Dense Component Layouts: Cuts very close to components without damage

• High-Speed, High-Yield Output: Suitable for mass production with minimal downtime

• Low Maintenance Operation: No physical blades to wear out or replace

• Flexibility Across PCB Types: Rigid, flex, rigid-flex, aluminum, and multilayer boards

Cutting Application of laser PCB depaneling machine 

FPC and some relative materials;

FPC/PCB/ Rigid‐Flex PCB cutting, Camera module cutting;

Images of PCB laser Depaning machine